微电子封装组件的建模和仿真

出版社:化学工业出版社
出版日期:2012-1
ISBN:9787122123725
作者:刘胜
页数:564页

书籍目录

ForewordForewordPrefaceAcknowledgmentsAbout the Autho Part I Mechanics and Modeling1 Co titutive Models and Finite Element Method1.1 Co titutive Models for Typical Materials1.1.1 Linear Elasticity1.1.2 Elastic-Visco-Plasticity1.2 Finite Element Method1.2.1 Basic Finite Element Equatio 1.2.2 Nonlinear Solution Methods1.2.3 Advanced Modeling Techniques in FiniteElement Analysis1.2.4 Finite Element Application in SemiconductorPackaging Modeling1.3 Chapter SummaryReferences2 Material and Structural Testing for Small Samples2.1 Material Testing for Solder Joints2.1.1 Specime 2.1.2 A Thermo-mechanical Fatigue Tester2.1.3 Te ile Test2.1.4 Creep Test2.1.5 Fatigue Test2.2 Scale Effect of Packaging Materials2.2.1 Specime 2.2.2 Experimental Results and Discussio 2.2.3 Thin Film Scale Dependence for Polymer Thin Films2.3 Two-ball Joint Specimen Fatigue Testing2.4 Chapter SummaryReferences3 Co titutive and Use-supplied Subroutines for Solde Co idering Damage Evolution3.1 Co titutive Model for Tin-lead Solder Joint3.1.1 Model Formulation3.1.2 Determination of Material Co tants3.1.3 Model Prediction3.2 Visco-elastic-plastic Properties and Co titutive Modeling of Under?lls3.2.1 Co titutive Modeling of Under?lls3.2.2 Identi?cation of Material Co tants3.2.3 Model Veri?cation and Prediction3.3 A Damage Coupling Framework of Uni?ed Viscoplasticityfor the Fatigure of Solder Alloys3.3.1 Damage Coupling Thermodynamic Framework3.3.2 Large Deformation Formulation3.3.3 Identi?cation of the Material Paramete 3.3.4 Creep Damage3.4 User-supplied Subroutines for Solde  Co ideringDamage Evolution3.4.1 Return-Mapping Algorithm and FEA Implementation3.4.2 Advanced Features of the Implementation3.4.3 Applicatio  of the Methodology3.5 Chapter SummaryReferences4 Accelerated Fatigue Life Assessment Approaches for Solde in Packages4.1 Life Prediction Methodology4.1.1 Strain-Based Approach4.1.2 Energy-Based Approach4.1.3 Fracture Mechanics-Based Approach4.2 Accelerated Testing Methodology4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue4.3 Co titutive Modeling Methodology4.3.1 Separated Modeling via Uni?ed Modeling4.3.2 Viscoplasticity with Damage Evolution4.4 Solder Joint Reliability via FEA4.4.1 Life Prediction of Ford Joint Specimen4.4.2 Accelerated Testing: I ights from Life Prediction4.4.3 Fatigue Life Prediction of a PQFP Package4.5 Life Prediction of Flip-Chip Packages4.5.1 Fatigue Life Prediction with and without Under?ll4.5.2 Life Prediction of Flip-Chips without Under?ll via Uni?ed and SeparatedCo titutive Modeling4.5.3 Life Prediction of Flip-Chips under Accelerated Testing4.6 Chapter SummaryReferences5 Multi-physics and Multi-scale Modeling5.1 Multi-physics Modeling5.1.1 Direct-coupled Analysis5.1.2 Sequential Coupling5.2 Multi-scale Modeling5.3 Chapter SummaryReferences6 Modeling Validation Tools6.1 Structural Mechanics Analysis6.2 Requirements of Experimental Methods for StructuralMechanics Analysis6.3 Whole Field Optical Techniques6.4 Thermal Strai  Measurements Using Moir e Interferometry6.4.1 Thermal Strai  in a Plastic Ball Grid Array(PBGA) Interconnection6.4.2 Real-time Thermal Deformation MeasurementsUsing Moir e Inteferometry6.5 In-situ Measurements on Micro-machined Se o 6.5.1 Micro-machined Membrane Structurein a Chemical Se or6.5.2 In-situ Measurement Using Twyman-GreenInterferometry6.5.3 Membrane Deformatio  due to Power Cycles6.6 Real-time Measurements Using Speckle Inteferometry6.7 Image Processing and Computer Aided Optical Techniques6.7.1 Image Processing for Fringe Analysis6.7.2 Phase Shifting Technique for IncreasingDisplacement Resolution6.8 Real-Time Thermal-Mechanical Loading Tools6.8.1 Micro Mechanical Testing6.8.2 Environmental Chamber6.9 Warpage Measurement Using PM-SM System6.9.1 Shadow Moir e and Project Moir e Setup6.9.2 Warpage Measurement of a BGA, Two Crowded PCBs6.10 Chapter SummaryReferences7 Application of Fracture Mechanics7.1 Fundamental of Fracture Mechanics7.1.1 Energy Release Rate7.1.2 J Integral7.1.3 Interfacial Crack7.2 Bulk Material Cracks in Electronic Packages7.2.1 Background7.2.2 Crack Propagation in Ceramic/Adhesive/Glass System7.2.3 Results7.3 Interfacial Fracture Toughness7.3.1 Background7.3.2 Interfacial Fracture Toughness of Flip-chip Packagebetween Passivated Silicon Chip and Under?ll7.4 Three-dime ional Energy Release Rate Calculation7.4.1 Fracture Analysis7.4.2 Results and Comparison7.5 Chapter SummaryReferences8 Concurrent Engineering for Microelectronics8.1 Design Optimizatio 8.2 New Developments and Trends in IntegratedDesign Tools8.3 Chapter SummaryReferences9 Typical IC Packaging and Assembly Processes9.1 Wafer Process and Thinning9.1.1 Wafer Process Stress Models9.1.2 Thin Film Deposition9.1.3 Backside Grind for Thinning9.2 Die Pick Up9.3 Die Attach9.3.1 Material Co titutive Relatio 9.3.2 Modeling and Numerical Strategies9.3.3 FEA Simulation Result of Flip-Chip Attach9.4 Wire Bonding9.4.1 Assumption, Material Properties and Method of Analysis9.4.2 Wire Bonding Process with Different Paramete 9.4.3 Impact of Ultrasonic Amplitude9.4.4 Impact of Ultrasonic Frequency9.4.5 Impact of Friction Coef?cients between Bond Pad and FAB9.4.6 Impact of Different Bond Pad Thickness9.4.7 Impact of Different Bond Pad Structures9.4.8 Modeling Results and Discussion for Cooling SubstrateTemperature after Wire Bonding9.5 Molding9.5.1 Molding Flow Simulation9.5.2 Curing Stress Model9.5.3 Molding Ejection and Clamping Simulation9.6 Leadframe Forming/Singulation9.6.1 Euler Forward ve us Backward Solution Method9.6.2 Punch Process Setup9.6.3 Punch Simulation by ANSYS Implicit9.6.4 Punch Simulation by LS-DYNA9.6.5 Experimental Data9.7 Chapter SummaryReferences10 Opto Packaging and Assembly10.1 Silicon Substrate Based Opto Package Assembly10.1.1 State of the Technology10.1.2 Monte Carlo Simulation of Bonding/Soldering Process10.1.3 Effect of Matching Fluid10.1.4 Effect of the Encapsulation10.2 Welding of a Pump Laser Module10.2.1 Module Description10.2.2 Module Packaging Process Flow10.2.3 Radiation Heat Tra fer Modeling for HermeticSealing Process10.2.4 Two-Dime ional FEA Modeling for Hermetic Sealing10.2.5 Cavity Radiation Analyses Results and Discussio 10.3 Chapter SummaryReferences11 MEMS and MEMS Package Assembly11.1 A Pressure Se or Packaging (Deformation and Stress)11.1.1 Piezoresistance in Silicon11.1.2 Finite Element Modeling and Geometry11.1.3 Material Properties11.1.4 Results and Discussion11.2 Mounting of Pressure Se or11.2.1 Mounting Process11.2.2 Modeling11.2.3 Results11.2.4 Experiments and Discussio 11.3 Thermo-Fluid Based Accelerometer Packaging11.3.1 Device Structure and Operation Principle11.3.2 Linearity Analysis11.3.3 Design Co ideration11.3.4 Fabrication11.3.5 Experiment11.4 Plastic Packaging for A Capacitance Based Accelerometer11.4.1 Micro-Machined Accelerometer11.4.2 Wafer-Level Packaging11.4.3 Packaging of Capped Accelerometer11.5 Tire Pressure Monitoring System (TPMS) Antenna11.5.1 Test of TPMS System with Wheel Antenna11.5.2 3D Electromagnetic Modeling of The Wheel Antenna11.5.3 Stress Modeling of I talled TPMS11.6 Thermo-Fluid Based Gyroscope Packaging11.6.1 Operating Principle and Design11.6.2 Analysis of Angular Acceleration Coupling11.6.3 Numerical Simulation and Analysis11.7 Microjets for Radar and LED Cooling11.7.1 Microjet Array Cooling System11.7.2 Preliminary Experiments11.7.3 Simulation and Model Veri?cation11.7.4 Comparison and Optimization of Three Microjet Devices11.8 Air Flow Se or11.8.1 Operation Principle11.8.2 Simulation of Flow Conditio 11.8.3 Simulation of Temperature Field on the Se orChip Surface11.9 Direct Numerical Simulation of Particle Separationby Direct Current Dielectrophoresis11.9.1 Mathematical Model and Implementation11.9.2 Results and Discussion11.10 Modeling of Micro-Machine for Use in Gastrointestinal Endoscopy11.10.1 Methods11.10.2 Results and Discussion11.11 Chapter SummaryReference12 System in Package (SIP) Assembly12.1 Assembly Process of Side by Side Placed SIP12.1.1 Multiple Die Attach Process12.1.2 Cooling Stress and Warpage Simulation after Molding12.1.3 Stress Simulation in Trim Process12.2 Impact of the Nonlinear Materials Behavio  on the Flip-chipPackaging Assembly Reliability12.2.1 Finite Element Modeling and Effect of Material Models12.2.2 Experiment12.2.3 Results and Discussio 12.3 Stacked Die Flip-chip Assembly Layout and the Material Selection12.3.1 Finite Element Model for the Stack Die FSBGA12.3.2 Assembly Layout Investigation12.3.3 Material Selection12.4 Chapter SummaryReferencesPart III Modeling in Microelectronic Package Reliability and Test13 Wafer Probing Test13.1 Probe Test Model13.2 Parameter Probe Test Modeling Results and Discussio 13.2.1 Impact of Probe Tip Geometry Shapes13.2.2 Impact of Contact Friction13.2.3 Impact of Probe Tip Scrub13.3 Comparison Modeling: Probe Test ve us Wire Bonding13.4 Design of Experiment (DOE) Study and Correlation of ProbingExperiment and FEA Modeling13.5 Chapter SummaryReferences14 Power and Thermal Cycling, Solder Joint Fatigue Life14.1 Die Attach Process and Material Relatio 14.2 Power Cycling Modeling and Discussion14.3 Thermal Cycling Modeling and Discussion14.4 Methodology of Solder Joint Fatigue Life Prediction14.5 Fatigue Life Prediction of a Stack Die Flip-chip on Silicon (FSBGA)14.6 Effect of Cleaned and Non-Cleaned Situatio  on the Reliabilityof Flip-Chip Packages14.6.1 Finite Element Models for the Clean and Non-Clean Cases14.6.2 Model Evaluation14.6.3 Reliability Study for the Solder Joints14.7 Chapter SummaryReferences15 Passivation Crack Avoidance15.1 Ratcheting-Induced Stable Cracking: A Synopsis15.2 Ratcheting in Metal Films15.3 Cracking in Passivation Films15.4 Design Modi?catio 15.5 Chapter SummaryReferences16 Drop Test16.1 Controlled Pulse Drop Test16.1.1 Simulation Methods16.1.2 Simulation Results16.1.3 Parametric Study16.2 Free Drop16.2.1 Simulated Drop Test Procedure16.2.2 Modeling Results and Discussion16.3 Portable Electronic Devices Drop Test and Simulation16.3.1 Test Set Up16.3.2 Modeling and Simulation16.3.3 Results16.4 Chapter SummaryReferences17 Electromigration17.1 Basic Migration Formulation and Algorithm17.2 Electromigration Examples from IC Device and Package17.2.1 A Sweat Structure17.2.2 A Flip-chip CSP with Solder Bumps17.3 Chapter SummaryReferences18 Popcorning in Plastic Packages18.1 Statement of Problem18.2 Analysis18.3 Results and Compariso 18.3.1 Behavior of a Delaminated Package due to PulsedHeating-Veri?cation18.3.2 Convergence of the Total Strain Energy Release Rate18.3.3 Effect of Delamination Size and Various Processesfor a Thick Package18.3.4 Effect of Moisture Expa ion Coef?cient18.4 Chapter SummaryReferencesPart IV Modern Modeling and Simulation Methodologies19 Classical Molecular Dynamics19.1 General Description of Molecular Dynamics Method19.2 Mechanism of Carbon Nanotube Welding onto the Metal19.2.1 Computational Methodology19.2.2 Results and Discussion19.3 Applicatio  of Car–Parrinello Molecular Dynamics19.3.1 Car–Parrinello Simulation of Initial Growth Stageof Gallium Nitride on Carbon Nanotube19.3.2 Effects of Mechanical Deformation on Outer SurfaceReactivity of Carbon Nanotubes19.3.3 Adsorption Con?guration of Magnesium on WurtziteGallium Nitride Surface Using Fi t-principles Calculatio 19.4 Nano-welding by RF Heating19.5 Chapter SummaryReferencesAppendixSummary of Continuous MechanicsIndex

编辑推荐

  虽然集成电路封装在设计阶段对建模和仿真的需求正在不断增加,但是目前的大多数组件工艺和多种可靠性测试仍然依据耗时的“测试一尝试”的方法来获得最优的方案。建模和仿真能够自如地通过虚拟实验设计的方法获得最优方案。这种方法极大地降低了电子产品的成本和生产时间,对于新产品的开发效果尤其显著。使用建模和仿真技术对促进未来三维封装的发展将会越来越有必要。在《微电子封装组件的建模和仿真:制造可靠性与测试》中,刘胜博士和刘勇博士将会介绍建模与仿真的基础知识和高级技巧以帮助相关领域的人员运用建模与仿真的方法解决他们遇到的问题。本书适用于微电子封装和互联设计、装配制造、可靠性/质量及半导体材料相关领域的工程师、研究人员和研究生。相关行业的产品经理、应用工程师和销售人员,在需要向客户介绍装配制造过程、可靠性和测试会如何影响产品质量时,也可以从本书中获得裨益。

作者简介

随着电子封装的发展,电子封装已从传统的四个主要功能(电源系统、信号分布及传递、散热及机械保护)扩展为六个功能,即增加了DFX及系统测试两个新的功能。其中DFX是为“X”而设计,X包括:可制造性、可靠性、可维护性、成本,甚至六西格玛。DFX有望在产品设计阶段实现工艺窗口的确定、可靠性评估和测试结构及参数的设计等功能,真正做到“第一次就能成功”,从而将计算机辅助工程(CAE)变为计算机主导工程(CE),以大大加速产品的上市速度。本书是全面介绍DFX在封装中应用的图书。作为封装工艺过程和快速可靠性评估及测试建模仿真的第一本专著,《微电子封装组件的建模和仿真——制造、可靠性与测试》中包含两位作者刘胜、刘勇在工业界二十多年的丰富经验,以及在MEMS、IC和LED封装部分成功的实例,希望能给国内同行起到抛砖引玉的作用。同时,读者将会从书中的先进工程设计和微电子产品的并行工程和协同设计方法中受益。
《微电子封装组件的建模和仿真——制造、可靠性与测试》主要读者对象为学习DFX(制造工艺设计、测试设计、可靠性设计等)的研究人员、工程师和学生等。

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