阵列波导器件耦合封装机理及其关键技术研究

出版日期:2015-9
ISBN:9781618960989
作者:Zheng Yu
页数:264页

内容概要

Zheng Yu, Central South University

书籍目录

FRONT MATTER
第一章 绪 论
第二章 阵列波导器件对准耦合与耦合界面光波传输特性研究
第三章 阵列波导器件对准耦合工艺与算法研究
第四章 阵列波导器件固接微位移生成与控制技术研究
第五章 阵列波导器件自动化封装装备集成研究
第六章 阵列波导器件封装试验研究
第七章 总结与展望
BACK MATTER

作者简介

Arrayed wave guide devices are the foundations of the next generation optical fiber communication technology development, which have bright and wide application prospects. These arrayed waveguide chips, similar in many ways to their electronic counterparts, are fabricated using wafer-level processing techniques and use optical waveguides to route photons, the same way that metal traces are used toroute electrons in an electronic chip. These devices include optical beam splitters/combiners for branching/ combining optical signals, optical switchers for changing optical paths, optical filtering for introducing multiple optical channels into a single optical fiber, and so on. These devices have many features, such ascompact structure, strong noise immunity, excellent property, and easy automation production, which are the developing frontiers of optoelectronic devices at present. Arrayed waveguide devices are rich in theirs categories and structures. With the rapid increasing demands for the quality devices of optical fiber communication system, many problems about mechanisms and rules of manufacturing process for arrayed waveguide devices packaging must be investigated more profoundly, in order to make a breakthrough in the manufacturing technologies, processes and equipment of arrayed wave guide devices.


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